The FPA series wafer edge finder is a four-axis controlled device that uses a miniature single-axis robotic module, characterized by high rigidity and small size. It achieves high-speed, efficient, and high-precision wafer edge detection and center position calibration. (Wafer position ≤ ±0.1mm; Wafer notch/flat ≤ ±0.1°)

Efficient operation, locating the wafer notch position in less than 7 seconds (excluding the time for wafer handling), quickly completing the correction of the wafer center and angle.

It supports both translucent and opaque wafer applications, suitable for silicon wafers and silicon carbide wafers with diameters ranging from 150 to 300mm.

Integrated design with a built-in controller, eliminating the need for an additional controller and wiring space, achieving an ultra-compact size.